Technology Unites Global Summit will take place virtually on 15 – 19 February 2021. Park Systems is proud to announce its participation as an exhibitor!
SEMI is thrilled to present a new event that brings together the global microelectronics supply chain, manufacturers, and end users for a digital experience featuring industry thought leaders and high value technical content.
Visit our virtual booth and discover innovative technological solutions from Park Systems for Semiconductor and Hard Disk markets, Failure Analysis, Wafer-Fab Manufacturing and Large Sample Research.
Have a live chat with our team about significant technological developments for semiconductor applications, such as Automatic Defect Review for Bare Wafers and Substrates, Long Range Profiling for CMP Characterization or discover the Tip Scan Head for OLEDs, LCDs and photomasks applications.
We will be featuring the Park NX-Tip Scan Head - the automated Atomic Force Microscopy (AFM) System for measuring ultra large and heavy flat panel displays at the nanoscale, which overcomes nanometrology challenges for sample dimensions over 300mm and weights above 1kg.
JOIN US ON:
- Event Dates: 15 – 19 February, 2021
- Our location: Park Systems digital booth
About the Technology Unites Global Summit:
The Technology Unites Global Summit brings together the global microelectronics supply chain, manufacturers and end users for a digital experience featuring industry thought leaders and high-value technical content from around the world.