随着半导体芯片技术进展,元器件特征尺寸横向微缩的同时,对于元器件纵向维度上的微缩、堆叠与平坦化控制也随之日趋重要,相关线上制程监控也越来越重要。传统量测仪器面对于纵向维度上制程监控需求正面临着挑战,然而原子力显微镜因其优异的纵向解析度与灵敏度,近年来也获得越来越多的关注。本文介绍原子力显微镜于现今半导体芯片制程技术的量测应用,以及其未来展望与挑战。
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