Trench Etch Profile on Si Wafer
Top dielectric trench etch profile on Si wafer having tapered slope at the trench sidewall.
Scanning Conditions
- System: NX20
- Scan Mode: Non-contact
- Cantilever: AC160TS (k=26N/m, f=300kHz)
- Scan Size: 3μm×3μm
- Scan Rate: 0.21Hz
- Pixel: 1024 × 256
- Scan Mode: Non-contact
- Cantilever: AC160TS (k=26N/m, f=300kHz)
- Scan Size: 3μm×3μm
- Scan Rate: 0.21Hz
- Pixel: 1024 × 256
Application
Related Modes
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