Mobile Display Panel
Conventional top-down AFM cannot accurately measure steep sidewalls or recessed regions due to limited tip access, restricting reliable etch profile analysis.
A tilted head with an ultra-sharp tip in non-contact mode enables direct access to Al-layer sidewalls and recess regions, capturing true geometry and clearly comparing recess depth and shape between samples for accurate etch process monitoring.
Scan Conditions
- System: NX-3DM
- Scan Mode: Non-contact
- Scan Size: 2 µm × 2 µm
- Scan Rate: 0.05 Hz
- Pixels: 4096 × 256
- Cantilever: EBD2-R2-NCLR (k = 45 N/m, f = 190 kHz)
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