Wafer Edge (Edge Bead Removal Region)
NX-Wafer Plus is an in-line AFM-based 360° edge profiling solution featuring a rotating stage and automated analysis software, enabling continuous edge scanning of 300 mm wafers at 2 mm/s over a 50 mm range.
Measurements in the Edge Bead Removal (EBR) region reveal localized surface non-uniformity for edge process monitoring.
Scan Conditions
- System: NX-Wafer Plus with Sample Rotation Stage
- Scan Mode: Contact (Profiling)
- Scan Size: 15.0 mm×7.0 µm
- Scan Speed: 2 mm/sec
- Pixels: 30000×512
- Cantilever: CDT-NCHR (k=80 N/m, f=400 kHz)
Application
Related Modes
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